MEMS Packaging by Tai-Ran Hsu
Material type:
TextPublication details: United Kingdom Institution of Electrical Engineers (IEE) 2004Description: xxix, 275pISBN: 0863413358Subject(s): Microelectronic packaging | Microelectromechanical systemsDDC classification: 621.381 HSU
Contents:
Table of Contents;
1 Fundamentals of ME
| Item type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
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REFERENCE BOOK
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LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.381 HSU (Browse shelf (Opens below)) | Copy 1 | Not for loan | 015797 | ||
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REFERENCE BOOK
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LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.381 HSU (Browse shelf (Opens below)) | Copy 2 | Not for loan | 015798 |
Total holds: 0
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| REF 621.381 HOB Building Electro-optical Systems: making it all work | REF 621.381 HSU Mems and Microsystems: design, manufacture, and nanoscale engineering | REF 621.381 HSU MEMS Packaging | REF 621.381 HSU MEMS Packaging | REF 621.381 IRE Surfaces, Interfaces, and Thin Films for Microelectronics | REF 621.381 IWA Nanotechnology and Nano-Interface Controlled Electronic Devices | REF 621.381 KER Smart Packaging Technologies for Fast Moving Consumer Goods |
Table of Contents;
1 Fundamentals of ME
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