MEMS/MOEMS Packaging : concepts, Designs, Materials, and Processes by Ken Gilleo
Material type:
TextPublication details: Auckland McGraw-Hill 2005Description: xiii, 220pISBN: 0071455566Subject(s): Nanotechnology | Microelectronic packaging | Microelectromechanical systemsDDC classification: 621.381046 GIL
Contents:
Table of Contents
Ch. 1 Engineering fun
| Item type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
REFERENCE BOOK
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LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.381046 GIL (Browse shelf (Opens below)) | Copy 1 | Not for loan | 015589 |
Total holds: 0
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| REF 621.381045 ZHA Electromagnetic Theory for Microwaves and Optoelectronics | REF 621.38104521 OSC Optical Detection Theory for Laser Applications | REF 621.381046 BAL Foldable Flex and Thinned Silcon Multichip Packaging Technology | REF 621.381046 GIL MEMS/MOEMS Packaging : concepts, Designs, Materials, and Processes | REF 621.381046 LAU Microvias: for low cost, high density interconnects | REF 621.381046 LAU Advanced MEMS Packaging | REF 621.381046 LI Electrical Conductive Ahesives with Nanotechnologies |
Table of Contents
Ch. 1 Engineering fun
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