Microvias: for low cost, high density interconnects John H. Lau
Material type:
TextPublication details: New York McGraw-Hill 2001Description: xxiii, 565ISBN: 0071363270Subject(s): Semiconductors -- junctions | Printed circuits | Microelectronic packaging | Integrated circuits -- Design and construction -- Cost control | Integrated circuits -- Design and constructionDDC classification: 621.381046 LAU
Contents:
Contents:
Ch.1 Introduction to Microvi
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REFERENCE BOOK
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LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.381046 LAU (Browse shelf (Opens below)) | Copy 1 | Not for loan | 018215 |
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| REF 621.38104521 OSC Optical Detection Theory for Laser Applications | REF 621.381046 BAL Foldable Flex and Thinned Silcon Multichip Packaging Technology | REF 621.381046 GIL MEMS/MOEMS Packaging : concepts, Designs, Materials, and Processes | REF 621.381046 LAU Microvias: for low cost, high density interconnects | REF 621.381046 LAU Advanced MEMS Packaging | REF 621.381046 LI Electrical Conductive Ahesives with Nanotechnologies | REF 621.381046 PRA Advanced Wirebond Interconnection Technology |
Contents:
Ch.1 Introduction to Microvi
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