Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices by Ungyu Paik
Material type:
TextPublication details: New York CRC Press 2009Description: xiii, 191pISBN: 1420059114Subject(s): Nanoparticles | Nanoelectronics | Chemical mechanical planarizationDDC classification: 621.38152 PAI
Contents:
Contents:
1. Overview of CMP Technology
| Item type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
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REFERENCE BOOK
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LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.38152 PAI (Browse shelf (Opens below)) | Copy 1 | Not for loan | 022583 |
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| REF 621.38152 MOR Advanced Semiconductors and Organic Nano-Techniques Part I: nanoscale electronics and optoelectronics | REF 621.38152 MUL Crystal Growth : from fundamentals to technology | REF 621.38152 MUR Copper Fundamental mechanisms for Microelectronic Applications | REF 621.38152 PAI Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices | REF 621.38152 PAV Silicon Photonics | REF 621.38152 PER Advanced Semiconductor Fundamentals, Vol VI | REF 621.38152 ROC Materials Science of Semiconductors |
Contents:
1. Overview of CMP Technology
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