Wafer Level 3-D ICs Process Technology by Chuan Seng Tan

By: Tan, Chuan SengContributor(s): Reif,L. Rafael | Gutmann, Ronald JMaterial type: TextTextPublication details: New York Springer 2008Description: xiv, 358pISBN: 9780387765327Subject(s): Applications enabled by 3-D integration | Three-dimensional (3-D) integration | Through Silicon vias (TSVs) | Wafer bonding - Wafer-Level 3-D Technology PlatformsDDC classification: 621.3815 TAN
Contents:
<p><strong>Table of Contents</strong></
Tags from this library: No tags from this library for this title. Log in to add tags.
    Average rating: 0.0 (0 votes)
Item type Current library Collection Call number Vol info Status Date due Barcode Item holds
REFERENCE BOOK REFERENCE BOOK LRC_JUIT
Computer Science & Engineering 		REFERENCE SECTION REF 621.3815 TAN (Browse shelf (Opens below)) Copy 1 Not for loan 027462
Total holds: 0

<p><strong>Table of Contents</strong></

There are no comments on this title.

to post a comment.

Library Home | Contact Us | LRC Help

Copyright @ 2020 LRC
Jaypee University of Information Technology
website hit counter

Powered by Koha