Semiconductor Device and Failure Analysis: Using Photon Emission Microscopy Wai Kin Chim
Material type:
TextPublication details: Singapore John Wiley & Sons 2000Description: xv, 269pISBN: 047149240XSubject(s): Semiconductors -- Microscopy | Semiconductors -- Testing | Semiconductors -- Failures | Photon emissionDDC classification: 621.38152 CHI
| Item type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
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TEXT BOOK
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LRC_JUIT Electronics & Communication Engineering | TEXTBOOK SECTION | 621.38152 CHI (Browse shelf (Opens below)) | Copy 1 | Available | 011751 | ||
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TEXT BOOK
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LRC_JUIT Electronics & Communication Engineering | TEXTBOOK SECTION | 621.38152 CHI (Browse shelf (Opens below)) | Copy 2 | Available | 011752 | ||
REFERENCE BOOK
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LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.38152 CHI (Browse shelf (Opens below)) | Copy 3 | Not for loan | 011753 |
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| 621.38152 CAM Science and Engineering of Microelectronic Fabrication | 621.38152 CAM Science and Engineering of Microelectronic Fabrication | 621.38152 CAM Science and Engineering of Microelectronic Fabrication | 621.38152 CHI Semiconductor Device and Failure Analysis: Using Photon Emission Microscopy | 621.38152 CHI Semiconductor Device and Failure Analysis: Using Photon Emission Microscopy | 621.38152 DIM Principles of Semiconductor Devices | 621.38152 DIM Principles of Semiconductor Devices |
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