OPAC_KOHA catalog › Details for: Wafer Bonding: applications and technology

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Wafer Bonding: applications and technology by M. Alexe

By: Alexe, MContributor(s): Gosele, UMaterial type: Text

TextPublication details: Berlin Springer Verlag 2004Description: xv, 499pISBN: 3540210490Subject(s): Semiconductor wafers | Semiconductors -- BondingDDC classification: 621.38152 ALE

Contents:

Contents : 1. Direct Bonding, Fusion Bo

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Item type	Current library	Collection	Call number	Vol info	Status	Date due	Barcode	Item holds
REFERENCE BOOK	LRC_JUIT Electronics & Communication Engineering	REFERENCE SECTION	REF 621.38152 ALE (Browse shelf (Opens below))	Copy 1	Not for loan		012710

Total holds: 0

Contents :
1. Direct Bonding, Fusion Bo

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