Advanced Wirebond Interconnection Technology Shankara K Prasad
Material type: TextPublication details: Boston Kluwer Academic Publishers 2004Description: xxviii, 668p. + 1 CD-ROMISBN: 1402077629Subject(s): Wire Bonding(Electronic Packaging) | Electronic Packaging -- ReliabilityDDC classification: 621.381046 PRAItem type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
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REFERENCE BOOK | LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.381046 PRA (Browse shelf (Opens below)) | Copy 1 | Not for loan | 015904 |
Total holds: 0
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