Adhesive Bonding in Photonics Assembly and Packaging B G Yacobi
Material type:
TextPublication details: California American Scientific Publishers 2003Description: xii, 173pISBN: 1588830195Subject(s): Physics | Photonics | Optoelectronic devices -- Design and construction | AdhesivesDDC classification: 621.36 YAC
| Item type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
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REFERENCE BOOK
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LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.36 YAC (Browse shelf (Opens below)) | Copy 1 | Not for loan | 011479 |
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| REF 621.36 SHA Nanophotonics with Surface Plasmons | REF 621.36 SIR Optical Components, Systems and Measurment Techniques | REF 621.36 SUD New Photonics Technologies for the Information Age : the dream of ubiquitous services | REF 621.36 YAC Adhesive Bonding in Photonics Assembly and Packaging | REF 621.3617 YAN Signal Processing for Magnetic Resonance Imaging and Spectroscopy | REF 621.362 CAP Infrared Detectors and Emitters: Materials and Devices | REF 621.362 KOK Glasses for Infrared Optics |
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