Electrical Modeling and Design for 3D Integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC Er-Ping Li
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TextPublication details: Hoboken John Wiley & Sons 2011Description: xiv, 366pISBN: 9780470623466Subject(s): TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI | Three-dimensional integrated circuitsDDC classification: 621.3815 LI
| Item type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
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REFERENCE BOOK
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LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.3815 LI (Browse shelf (Opens below)) | Copy 1 | Not for loan | 028449 |
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| REF 621.3815 KUL Electronic Circuit Design: from concept to implementation | REF 621.3815 LEE Subband Adaptive Filtering: Theory and Implementation | REF 621.3815 LEI Designing SOCs with Configured Cores: unleashing the tensilica Xtensa and diamond cores | REF 621.3815 LI Electrical Modeling and Design for 3D Integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC | REF 621.3815 LUN Handbook of Hybrid Systems Control: theory, tools, applications | REF 621.3815 MAR High-Level Modeling and Synthesis of Analog Integrated Systems | REF 621.3815 MAR Printed Circuit Assembly Design |
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