Balde, John W <br/><br/>
Foldable Flex and Thinned Silcon Multichip Packaging Technology 
by John W Balde 
 - Boston  Kluwer Academic Publishers  2003 
 - xix, 338p. 
<br/><br/>Table of Contents<br/>1 3-D Assemblies of S 
<br/><br/><label>ISBN: </label>0792376765 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Multichip Modules (Microelectronics)<br/>Microelectronic packaging<br/>Chip scale packaging
<br/><br/><label>Dewey Class. No.: </label>621.381046 BAL