TY  - BOOK
AU  - Hsu, Tai-Ran
TI  - MEMS Packaging
SN  - 0863413358
U1  - 621.381 HSU 
PY  - 2004///
CY  - United Kingdom
PB  - Institution of Electrical Engineers (IEE)
KW  - Microelectronic packaging
KW  - Microelectromechanical systems
N1  - Table of Contents;
1 Fundamentals of ME
ER  -