Lau, John H. <br/><br/>
Microvias: for low cost, high density interconnects 
John H. Lau 
 - New York  McGraw-Hill  2001 
 - xxiii, 565 
<br/><br/>Contents:<br/>Ch.1 	Introduction to Microvi 
<br/><br/><label>ISBN: </label>0071363270 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Semiconductors -- junctions<br/>Printed circuits<br/>Microelectronic packaging<br/>Integrated circuits -- Design and construction -- Cost control.<br/>Integrated circuits -- Design and construction.
<br/><br/><label>Dewey Class. No.: </label>621.381046 LAU