TY  - BOOK
AU  - Lau, John H.
AU  - Lee, S.W. Ricky
TI  - Microvias: for low cost, high density interconnects
SN  - 0071363270
U1  - 621.381046 LAU 
PY  - 2001///
CY  - New York
PB  - McGraw-Hill
KW  - Semiconductors -- junctions
KW  - Printed circuits
KW  - Microelectronic packaging
KW  - Integrated circuits -- Design and construction -- Cost control
KW  - Integrated circuits -- Design and construction
N1  - Contents:
Ch.1 	Introduction to Microvi
ER  -