TY  - BOOK
AU  - Paik, Ungyu
AU  - Park, Jea-Gun
TI  - Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices
SN  - 1420059114
U1  - 621.38152 PAI 
PY  - 2009///
CY  - New York
PB  - CRC Press
KW  - Nanoparticles
KW  - Nanoelectronics
KW  - Chemical mechanical planarization
N1  - Contents:
1. Overview of CMP Technology
ER  -