Li, Er-Ping <br/><br/>
Electrical Modeling and Design for 3D Integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC 
Er-Ping Li 
 - Hoboken  John Wiley & Sons  2011 
 - xiv, 366p. 
<br/><br/><label>ISBN: </label>9780470623466 
<br/><br/><label>Subjects--Topical Terms: </label><br/>TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI<br/>Three-dimensional integrated circuits
<br/><br/><label>Dewey Class. No.: </label>621.3815 LI