OPAC_KOHA catalog › Results of search for 'au:"Lau, John H."'

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	1.	Microvias: for low cost, high density interconnects John H. Lau by Lau, John H \| Lee, S.W. Ricky. Material type: Text Publication details: New York McGraw-Hill 2001Availability: Items available for reference: Not for loanCall number: REF 621.381046 LAU (1). : Request article Add to cart (remove)
	2.	Advanced MEMS Packaging John H. Lau by Lau, John H. Material type: Text Publication details: New York McGraw-Hill 2010Availability: Items available for reference: Not for loanCall number: REF 621.381046 LAU (1). : Request article Add to cart (remove)