Microvias: for low cost, high density interconnects John H. Lau
Material type:
TextPublication details: New York McGraw-Hill 2001Description: xxiii, 565ISBN: 0071363270Subject(s): Semiconductors -- junctions | Printed circuits | Microelectronic packaging | Integrated circuits -- Design and construction -- Cost control | Integrated circuits -- Design and constructionDDC classification: 621.381046 LAU
Contents:
Contents:
Ch.1 Introduction to Microvi
| Item type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
REFERENCE BOOK
|
LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.381046 LAU (Browse shelf (Opens below)) | Copy 1 | Not for loan | 018215 |
Total holds: 0
Contents:
Ch.1 Introduction to Microvi
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