Electrical Modeling and Design for 3D Integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC Er-Ping Li
Material type:
TextPublication details: Hoboken John Wiley & Sons 2011Description: xiv, 366pISBN: 9780470623466Subject(s): TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI | Three-dimensional integrated circuitsDDC classification: 621.3815 LI
| Item type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
REFERENCE BOOK
|
LRC_JUIT Electronics & Communication Engineering | REFERENCE SECTION | REF 621.3815 LI (Browse shelf (Opens below)) | Copy 1 | Not for loan | 028449 |
Total holds: 0
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