| 000 | 00731nam a2200241Ia 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20230314103940.0 | ||
| 008 | 180620b2003 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a0792376765 | ||
| 040 | _cJUIT, Solan | ||
| 082 | _a621.381046 BAL | ||
| 100 | _aBalde, John W | ||
| 245 |
_aFoldable Flex and Thinned Silcon Multichip Packaging Technology _cby John W Balde |
||
| 260 |
_aBoston _bKluwer Academic Publishers _c2003 |
||
| 300 | _axix, 338p. | ||
| 365 | _a.00 | ||
| 505 | _aTable of Contents 1 3-D Assemblies of S | ||
| 650 | _aMultichip Modules (Microelectronics) | ||
| 650 | _aMicroelectronic packaging | ||
| 650 | _aChip scale packaging | ||
| 906 | _a2daea2237f00000100cad5d9145d052d | ||
| 942 |
_2ddc _cRB |
||
| 999 |
_c11292 _d11292 |
||