| 000 | 00766nam a2200253Ia 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20230326115619.0 | ||
| 008 | 180620b2009 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a1420059114 | ||
| 040 | _cJUIT, Solan | ||
| 082 | _a621.38152 PAI | ||
| 100 | _aPaik, Ungyu | ||
| 245 |
_aNanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices _cby Ungyu Paik |
||
| 260 |
_aNew York _bCRC Press _c2009 |
||
| 300 | _axiii, 191p. | ||
| 365 | _a.00 | ||
| 505 | _aContents: 1. Overview of CMP Technology | ||
| 650 | _aNanoparticles | ||
| 650 | _aNanoelectronics | ||
| 650 | _aChemical mechanical planarization. | ||
| 700 | _aPark, Jea-Gun | ||
| 906 | _a2dbd452d7f0000010005a21b3a2d4337 | ||
| 942 |
_2ddc _cRB |
||
| 999 |
_c15170 _d15170 |
||