000 00611nam a2200157Ia 4500
008 180620b2011 xxu||||| |||| 00| 0 eng d
020 _a9780470623466
082 _a621.3815 LI
100 _aLi, Er-Ping
245 _aElectrical Modeling and Design for 3D Integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC
_cEr-Ping Li
260 _aHoboken
_bJohn Wiley & Sons
_c2011
300 _axiv, 366p.
650 _aTECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI
650 _aThree-dimensional integrated circuits
906 _a8e5eb2b4ac1049190121ce38aafd0b63
999 _c63010
_d63010