000 | 00611nam a2200157Ia 4500 | ||
---|---|---|---|
008 | 180620b2011 xxu||||| |||| 00| 0 eng d | ||
020 | _a9780470623466 | ||
082 | _a621.3815 LI | ||
100 | _aLi, Er-Ping | ||
245 |
_aElectrical Modeling and Design for 3D Integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC _cEr-Ping Li |
||
260 |
_aHoboken _bJohn Wiley & Sons _c2011 |
||
300 | _axiv, 366p. | ||
650 | _aTECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI | ||
650 | _aThree-dimensional integrated circuits | ||
906 | _a8e5eb2b4ac1049190121ce38aafd0b63 | ||
999 |
_c63010 _d63010 |