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Balde, John W

Foldable Flex and Thinned Silcon Multichip Packaging Technology by John W Balde - Boston Kluwer Academic Publishers 2003 - xix, 338p.

Table of Contents
1 3-D Assemblies of S

ISBN: 0792376765

Subjects--Topical Terms:
Multichip Modules (Microelectronics)
Microelectronic packaging
Chip scale packaging

Dewey Class. No.: 621.381046 BAL

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