OPAC_KOHA catalog › Details for: Foldable Flex and Thinned Silcon Multichip Packaging Technology

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Foldable Flex and Thinned Silcon Multichip Packaging Technology by John W Balde

By: Balde, John WMaterial type: Text

TextPublication details: Boston Kluwer Academic Publishers 2003Description: xix, 338pISBN: 0792376765Subject(s): Multichip Modules (Microelectronics) | Microelectronic packaging | Chip scale packagingDDC classification: 621.381046 BAL

Contents:

Table of Contents 1 3-D Assemblies of S

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Item type	Current library	Collection	Call number	Vol info	Status	Date due	Barcode	Item holds
REFERENCE BOOK	LRC_JUIT Electronics & Communication Engineering	REFERENCE SECTION	REF 621.381046 BAL (Browse shelf (Opens below))	Copy 1	Not for loan		020564

Total holds: 0

Table of Contents
1 3-D Assemblies of S

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