OPAC_KOHA catalog › Results of search for 'ccl=su:"Electronic packaging"'

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	1.	Nano-bio-electronic, Photonic and Mems Packaging Edited by C.P. Wong by Wong, C.P. Edition: 1st ed.Material type: Text Publication details: New York Springer Verlag, Netherlands 2010Availability: Items available for reference: Not for loanCall number: REF 621.381046 WON (1). : Request article Add to cart (remove)
	2.	Electronic Packaging and Interconnection Handbook by Harper, Charles A. by Harper, Charles A. Edition: 4th ed.Material type: Text Publication details: New York McGraw-Hill 2005Availability: Items available for reference: Not for loanCall number: RES 621.381046 HAR (2). : Request article Add to cart (remove)
	3.	Advanced Wirebond Interconnection Technology Shankara K Prasad by Prasad, Shankara K. Material type: Text Publication details: Boston Kluwer Academic Publishers 2004Availability: Items available for reference: Not for loanCall number: REF 621.381046 PRA (1). : Request article Add to cart (remove)
	4.	Advanced Wirebond Interconnection Technology Shankara K Prasad by Prasad, Shankara K. Material type: Text Publication details: Boston Kluwer Academic Publishers 2004Availability: Items available for loan: Call number: CDR 621.381046 PRA (1). Place hold Request article Add to cart (remove)
	5.	Electrical Conductive Ahesives with Nanotechnologies Yi Li by Li, Yi \| Wong, C. P \| Lu, Daniel. Material type: Text Publication details: New York ; London Springer Verlag, Netherlands 2010Availability: Items available for reference: Not for loanCall number: REF 621.381046 LI (1). : Request article Add to cart (remove)

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