Your search returned 6 results.

1.
Foldable Flex and Thinned Silcon Multichip Packaging Technology by John W Balde

by Balde, John W.

Material type: Text Text Publication details: Boston Kluwer Academic Publishers 2003Availability: Items available for reference: Not for loanCall number: REF 621.381046 BAL (1). :

Request article Add to cart
2.
Mems and Microsystems: design, manufacture, and nanoscale engineering by Tri ran Hsu

by Hsu, Tri ran.

Edition: 2nd edMaterial type: Text Text Publication details: New Jersey John Wiley & Sons 2008Availability: Items available for reference: Not for loanCall number: REF 621.381 HSU (1). :

Request article Add to cart
3.
MEMS Packaging by Tai-Ran Hsu

by Hsu, Tai-Ran.

Material type: Text Text Publication details: United Kingdom Institution of Electrical Engineers (IEE) 2004Availability: Items available for reference: Not for loanCall number: REF 621.381 HSU (2). :

Request article Add to cart
4.
MEMS/MOEMS Packaging : concepts, Designs, Materials, and Processes by Ken Gilleo

by Gilleo, Ken.

Material type: Text Text Publication details: Auckland McGraw-Hill 2005Availability: Items available for reference: Not for loanCall number: REF 621.381046 GIL (1). :

Request article Add to cart
5.
Microvias: for low cost, high density interconnects John H. Lau

by Lau, John H | Lee, S.W. Ricky.

Material type: Text Text Publication details: New York McGraw-Hill 2001Availability: Items available for reference: Not for loanCall number: REF 621.381046 LAU (1). :

Request article Add to cart
6.
Advanced MEMS Packaging John H. Lau

by Lau, John H.

Material type: Text Text Publication details: New York McGraw-Hill 2010Availability: Items available for reference: Not for loanCall number: REF 621.381046 LAU (1). :

Request article Add to cart

Library Home | Contact Us | LRC Help

Copyright @ 2020 LRC
Jaypee University of Information Technology
website hit counter

Powered by Koha